1半导体封装技术简介
Flip chip technology connects components directly down to the substrate, carrier, or circuit board through bumps on the chip.This packaging technology has a high signal density, small volume, high-speed transmission and good heat conduction performance, so it is widely used in the semiconductor industry.
2倒装芯片的发展历程
When packaging traditional chips, wafers are usually cut into Die, and then each Die is packaged. In the new semiconductor package, the packaging process is integrated with the semiconductor process, and the chip is unified packaged on the wafer, and then cut into an independent chip with higher reliability.
Flip chip components are mainly used in semiconductor devices, and some components, such as passive filters, detection antennas, and memory devices are also beginning to use flip chip technology because the chip is directly connected to the substrate and carrier through the convex points. Therefore, to be more precise, flip Chip is also called DCA(Direct Chip Attach). In the following figure, electronic products such as cpus and memory bars are common devices that use flip chip technology
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The following figure shows that the memory chip in the memory bar is connected to the circuit board through the flip technology, and the middle of the chip and the circuit board is fixed by filling glue.
The small IC pin pattern (only 5% of the flat package) reduces height and weight.
02Function enhancement
Using flip chips can increase the amount of I/O. I/O is not limited by the number of wires that bond around the chip. Surface arrays can interconnect more signals, power, and power supplies in a smaller space. The general flip chip pad can reach 400.
Disadvantages of flip connection technology:
(a) Bare chips are difficult to test;
(b) Convex chip has limited adaptability
(c) PCB technology is facing challenges as the spacing decreases and the number of pins increases;
(d) X-ray inspection equipment must be used to detect invisible solder joints;
(e) Poor compatibility with SMT processes;
(f) The operation of the bare chip clamping is difficult;
(g) High assembly accuracy required;
(h) The current use of bottom fill requires a certain curing time;
(i) Some substrates are less reliable
(j) Maintenance is difficult or impossible
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